YES Secures Orders for Advanced VertaCure PLP Systems
Netherlands, Saturday, 11 January 2025.
Yield Engineering Systems received significant orders for its VertaCure PLP systems, crucial to semiconductor manufacturing, underscoring the Netherlands’ pivotal role in global tech supply chains.
Semiconductor Manufacturing Breakthrough
Yield Engineering Systems (YES), based in Fremont, California, has secured multiple orders for their advanced VertaCure PLP systems from a leading Japanese semiconductor manufacturer [1][2]. This development represents a significant advancement in semiconductor manufacturing technology, specifically in the realm of artificial intelligence (AI) and high-performance computing (HPC) solutions [2].
Technical Innovation and Capabilities
The VertaCure PLP system stands out as a fully automated vacuum curing system designed for advanced packaging applications [2][3]. The system supports various panel sizes, including dimensions of 600 mm x 600 mm, 510 mm x 515 mm, and 300 mm x 300 mm [2]. A key innovation is its ability to provide complete removal of residual solvents while maintaining uniform temperature distribution through precise management of heating and cooling rates [1][2].
Impact on AI and HPC Development
According to Saket Chadda, SVP of Dry BU at YES, the semiconductor industry is evolving towards chiplet-based architecture that delivers enhanced performance, larger memory capacity, and improved heat dissipation capabilities [2][3]. The VertaCure PLP system specifically addresses these needs by supporting panel-based substrates, which are essential for accommodating larger substrate sizes and increasing bandwidth requirements [3].
Market Leadership and Future Implications
Alex Chow, SVP Worldwide Sales and Business Development at YES, notes that this order establishes their position as market leaders in curing tools [2]. The system’s significance lies in its ability to provide superior mechanical, thermal, and electrical properties for various polymers used in wafer-level packaging, which are crucial for AI and HPC applications [2][3]. The technology delivers superior quality and improved total cost of ownership, particularly for manufacturing advanced 2.5D and 3D packaging solutions [2].