TNO Integrates CITC to Strengthen Chip Packaging Innovation
Nijmegen, Monday, 20 October 2025.
TNO’s integration of the Chip Integration Technology Center (CITC) aims to boost innovation in chip packaging and strengthen the semiconductor ecosystem in Nijmegen, effective January 1, 2026.
Strategic Integration for Technological Advancement
On October 20, 2025, TNO announced the strategic integration of the Chip Integration Technology Center (CITC) into its operations, which will be effective from January 1, 2026. This move aims to bolster TNO’s position as a leader in chip packaging innovation technologies and enhance the regional semiconductor ecosystem in Nijmegen. The integration is expected to intensify research and development efforts in advanced chip packaging, a crucial area for the future of the semiconductor industry in the Netherlands, particularly as global demand for advanced chips continues to rise [1][2][3].
Benefits of Chip Packaging Innovation
The integration of CITC into TNO brings numerous benefits, including increased stability and continuity in CITC’s research operations. Advanced chip packaging technologies are vital for improving the performance and efficiency of semiconductor devices, which are essential components in a wide range of applications, from consumer electronics to industrial machinery. By enhancing its chip packaging capabilities, TNO aims to strengthen the semiconductor ecosystem in Nijmegen and connect it with other leading technology hubs, such as Eindhoven [1][2][3].
How the Integration Works
CITC, founded in 2019 by TNO and Delft University of Technology (TU Delft), has developed into a broad research and development hub for advanced chip packaging. The integration will formalize CITC’s role within TNO’s High Tech Industry business unit and will remain based at the Noviotech Campus in Nijmegen. This integration will enable TNO to expand its research efforts and contribute to the further development of Lifeport in Nijmegen as a strong, future-proof semiconductor ecosystem [1][2][3].
Leadership and Vision
The integration highlights TNO’s ambition to be a key player in the development of advanced chip packaging in the Netherlands. According to Arnaud de Jong, director of High Tech Industry at TNO, this move will help TNO intensify its research efforts and strengthen its position in the global semiconductor industry. Jeroen van den Brand, general manager of CITC, noted the integration as a significant milestone that underscores a shared vision for advancing chip integration and packaging technology [1][2][3].