Dutch Research Institute TNO Extends Partnership with Japanese Firm to Advance Critical Chip Technology
Delft, Tuesday, 28 April 2026.
TNO and Ushio have successfully tested increased source frequency in their extreme ultraviolet light technology, opening new research possibilities for next-generation semiconductor manufacturing. This advancement strengthens the Netherlands’ position in the global chip equipment industry, supporting companies like ASML that depend on EUV technology for producing the world’s most advanced computer processors.
Understanding EUV Technology’s Role in Semiconductor Manufacturing
This partnership focuses on extreme ultraviolet (EUV) lithography technology, a critical component of semiconductor manufacturing that enables the production of the world’s most advanced computer chips [1]. EUV lithography uses extremely short wavelength light to etch incredibly precise patterns onto silicon wafers, allowing chipmakers to create transistors at the nanometer scale required for modern processors [GPT]. The technology operates through TNO’s EBL2 facility, an experimental EUV facility in a controlled vacuum environment designed to study radiation-induced effects on optics and reticles [1]. This facility uses Ushio’s high-intensity Sn-LDP (Laser-assisted Discharge-produced Plasma) pulse-based EUV light source that mimics lithography scanner conditions for repeatable testing [1].
Timeline of TNO-Ushio Collaboration and Recent Breakthrough
The collaboration between TNO and Ushio Inc. began in 2015 with the establishment and advancement of the EBL2 facility at TNO’s high-tech research campus in Delft [1][5]. In late 2023, the two organizations formalized a multi-year agreement to improve maintenance effectiveness and enhance reliability and predictability of the EUV light source [1][5]. Most significantly, TNO and Ushio recently successfully tested an increased source frequency, enabling new research possibilities for EBL2 and supporting next-generation EUV development activities [1][5]. This technical advancement represents a crucial step forward in making EUV technology more efficient and reliable for commercial semiconductor production.
Strategic Importance for Netherlands’ Semiconductor Leadership
The continued partnership reinforces the Netherlands’ position as a global leader in semiconductor equipment technology, particularly through companies like ASML that rely heavily on EUV technology for next-generation chip production [GPT]. TNO’s Director of Operations Rob Willekers emphasized that “this long-term partnership forms a strong foundation for continuously advancing our research capabilities” and supports the organization’s mission to serve customers and partners with world-leading EUV expertise [1]. The collaboration directly supports ASML’s dominance in the EUV lithography market, where the company’s scanners are essential for producing the most advanced semiconductors used in smartphones, computers, and artificial intelligence systems [GPT].
Industry Context and Future Implications
The advancement comes at a critical time for the semiconductor industry, as companies push toward even more precise manufacturing capabilities. Current EUV technology operates at 0.33 numerical aperture with overlay accuracy of approximately 1.1 nanometers, but the industry is targeting sub-angstrom overlay accuracy of less than 0.1 nanometers for high-NA EUV systems with numerical aperture of 0.55 or higher [2]. However, adoption of the most advanced high-NA EUV systems faces cost challenges, with each unit costing over €350 million (approximately $410 million), leading major chip manufacturer TSMC to announce it will not deploy ASML’s High-NA EUV lithography in production before the end of 2029 [4]. Ushio’s Executive Officer Yoshihiko Sato stated that the company “remains dedicated to enhancing the performance and reliability of our light sources and will continue to support further breakthroughs in EUV technology” [1], indicating continued investment despite these market challenges.